| 摘要 |
PURPOSE:To prevent irregular cracks from being generated in a glass film when a semiconductor substrate is divided into pellets, by forming the glass film only in sorrounding parts except a part of the main surface of the semiconductor substrate. CONSTITUTION:Grid-shaped mesa groove 2 is formed on one main surface, at least, of semiconductor substrate 1 having two main surfaces by etching. Next, glass film 3 is formed on mesa groove 2 except part 11 in intersecting part 10 of mesa groove 2. Next, grid-shaped cut 5 is provided along mesa groove 2, and substrate 1 is divided into pellets 6 along this cut 5. As a result, since corner parts of pellet 6 are not covered with galss film 3, glass film 3 is prevented from cracking complicatedly in corner parts of pellet 6 where a complicated force is applied, so that glass film 3 can be prevented from protruding.
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