| 摘要 |
<p>A low cost, lightweight, helically preformed line tie is disclosed which is configured for yieldably securing an elongated conductor or the like to various standard sizes of conventional, grooved insulative supports without the need for specialized ties by provision of a unitary, substantially shape-retaining resilient metallic wire tie which includes a central, generally U-shaped, line-receiving bight and a pair of legs extending therefrom which have intermediate sections adjacent the bight and helically formed line-gripping terminal sections; in preferred forms, the intermediate sections include a pair of interconnected, generally straight segments disposed at an angle relative to each other, and the intermediate sections are wrapped under tension about the support body with the helical leg sections secured about the line for yieldably securing the latter to the support without creation of localized, rigidly held stress areas at the line support points which can lead to premature line failure by virtue of bending movements of the line at the support points. In this manner characteristic wind-induced line vibrations can be safely and effectively dampened along a relatively long length of the line adjacent the insulator which reduces wear and tear of the line. A simplified tie forming method is also provided which permits essentially automatic, assembly line production of the ties through the use of sequential bend-forming stations and a unique mandreltype helical forming station which completely eliminates complicated forming implements and methods heretofore employed.</p> |
