发明名称 Contact structure for a multiple semiconductor component
摘要 A contact structure for a multiple semiconductor component comprises at least two adjacent hand shaped connecting contact arrangements with the fingers parting in opposite directions and splayed out, each finger being interrupted by one of the individual semiconductor components.
申请公布号 US4162507(A) 申请公布日期 1979.07.24
申请号 US19770865596 申请日期 1977.12.28
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH 发明人 FISHER, KONRAD
分类号 H01L31/0264;H01L23/482;H01L27/146;H01L31/02;H01L31/0224;(IPC1-7):01L23/48;01L29/44;01L29/52 主分类号 H01L31/0264
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