发明名称 Arrangement for semiconductor power components
摘要 An arrangement for semiconductor power components in an installation, in which at least one semiconductor power component is placed between contact pieces and is enclosed in a housing exhibiting an insulator and connecting pieces. The arrangement includes current conductors which promote safety and prevent explosion by absorbing electric arcs formed in the installation. The current conductors are placed laterally adjacent to the contact pieces and annularly surrounding the latter, separated from the interior wall of the insulator by narrow gaps. Additional embodiments of the present invention employ reinforcing elements around the housing, and explosion guards around the housing, thereby further enhancing installation safety.
申请公布号 US4162514(A) 申请公布日期 1979.07.24
申请号 US19770834263 申请日期 1977.09.19
申请人 BBC BROWN BOVERI & CO LTD 发明人 DE BRUYNE, PATRICK;NIEMEYER, LUTZ
分类号 H01L23/04;H01L23/00;H01L23/051;H01L23/16;H01L23/492;H01L23/60;(IPC1-7):H02H7/20 主分类号 H01L23/04
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