| 摘要 |
An electrical contact material which is particularly well suited for use in circuit breaker switches consisting essentially of silver in the amount of about 20% to 50% by weight, nickel in the amount of about 2% to 13% by weight, phosphorus in the amount of about 90 ppm to 1000 ppm, and the remainder tungsten. In one embodiment of the contact material forming method provided by the invention, starting particle sizes and liquid phase sintering parameters are selected to yield a relatively coarse grain size in the contact material microstructure with an optimum combination of resistance to oxidation, electrical erosion and distortion associated with high-current interruptions.
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