SEALING METHOD FOR RESIN MOLD SEMICONDUCTOR DEVICE,申请号JP19770157806-传众专利搜索

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发明名称	SEALING METHOD FOR RESIN MOLD SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS5492058(A)	申请公布日期	1979.07.20
申请号	JP19770157806	申请日期	1977.12.29
申请人	FUJI ELECTRIC CO LTD	发明人	OOTANI AKIRA;NAKADA KATSUEI;MURAMATSU AKIO;MARUYAMA ATSUSHI
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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