| 摘要 |
<p>PURPOSE:To form a bump type device with no broken chip circumference while preventing a sticking material from swelling during junction mounting. CONSTITUTION:Bump terminals 3 on insulating film 2 of Si substrate 1 and mounting metal on its reverse surface are provided matching with pelletizing separation region 11. Separation groove 12 is made by cutting the substrate along region 11 until the middle of thickness (t1) of substrate 1. Then, sticky sheets 13a and 13b are stuck to the top and reverse surfaces of the substrate and the substrate is cleaved 14 from the bottom of groove 12 and made into chips. In this state, sheet 13a is removed and lead 15 on the mounting substrate is connected to bump terminal 3. Since no wax is used, the wax will neither swell over the flank of the chip not stick to the main surface, so that the yield and quality will both improve. Lastly, the chip adhered to lead 15 is pulled up as it is.</p> |
