| 摘要 |
Circuit components such as frequency filters, impedance transformers, and time delay elements are fabricated into an assembly which is electrically and mechanically coupled to the center conductor. A seamless dielectric material is telescoped over the assembly and then the assembly is telescoped into a seamless outer jacket of conductive material. Then the ID of the outer jacket is reduced into contact with the dielectric material surrounding said assembly and center conductor by drawing said jacket through a die.
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