| 摘要 |
PURPOSE:To make preventable the generation of the solder bridge, by dipping the high density flat lead in the solder liquid for a specified period, and then, by pulling this flat lead away from the solder liquid at a constant speed while giving the vertical vibration. CONSTITUTION:First of all, the lead terminal 2 is dipped into a specified depth of the solder liquid 3; after passing a specified period of dipping, the lead terminal 2 is pulled up in the arrowed direction A at a specified speed. And, when the tip of the lead 2 comes to the position just berfore leaving the surface of the solder liquid as illustrated by the full line, a vertical vibration like as the arrowed mark B, for instance with the amplitude 0.2-0.3mm and the frequency 20Hz, etc., is given to entire parts. Hereby, the lead 2, as illustrated by the imaginary line, being vertically vibrated, leaves the surface 3 of the solder liquid. Hereby, the excess solder, sticking to the lead 2 and tending to cause the solder bridge, is shaken off by the vertical vibration B. Accordingly, the preparatory soldering of the lead can be simply, excellently performed. |
