| 摘要 |
<p>PURPOSE:To effectively operate prevention of a stress concentration by engaging the side of a molding resin with the side face of the recess of a card board. CONSTITUTION:Both faces of an integral base material 5 and an outer extension 13 are formed of a die pad 14, a wiring pattern 8 and an outer terminal 9 by photoetching, holes communicating with the pattern 8 and the terminal 9 are opened at the extension 13, its sidewall is coated by plating 111 io form through holes 11. Then, an IC 7 is mounted on the pad 14, and the IC 7 is connected to the pattern 8 by wirings 10. Then, many molding resins 12 are molded at once by setting in an integrated injection mold. An opening is formed at a card board 1 to form a recess 3, adhesive adheres thereto, the integrated IC module 4 is engaged with the extension 13, they are held at a mirror face plate, heated, and pressurized to form an IC card.</p> |
