| 摘要 |
<p>A curable epoxy compn. comprises an epoxide resin having an average of >=1 1,2-epoxide gp. per molecule and 1-100 wt. % of a diamine curing agent of formula (I) (where one R is NH2 and the other is Cl; X is Cl and n = 1-3). (I) produces cured epoxy resins with improved moisture resistance and higher Tg on exposure to high humidity. The resins are used in fibrous composites, structural adhesives and coatings. In an example, a polyglycidyl ether of tris(hydroxyphenyl)methane was heated with 2,6-dichloro-1,4-benzene diamine to give a cured resin of Tg 270 degrees C and Tg after a 24 hour water boil of 212 degrees C.</p> |
