| 摘要 |
PURPOSE:To achieve complicated and high function at limited space, by locating two semiconductor chips oposingly by bridging the leads and by bonding the bump or bump and lead on the opposing planes. CONSTITUTION:A number of bump electrodes 14a,14b,16a,16b are provided for the IC chips 14 and 16 for the surface, and the electrodes 14a and 14b are bonded with the lead 12 corresponding to the carrier tape 10. The chip 16 is laminated on the chip 14 and the electrodes 16a,16b are bonded with the electrodes 14a,14b or the lead 12. As required, dummy bumps are provided. After that, sealing is made by dropping the liquid resin 18. With this constitution, complicated and high function device can be manufactured in a limited space. |
