Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites.

摘要

An individual chip soldering machine comprising an infrared heat source (42) enclosed by an energy concentrating reflector (44). The energy outlet from the reflector is covered by a quartz plate (46). A shield member (48) defines a second energy outlet (13). Vacuum suction can be admitted to the chamber (47) to hold a chip against the wall (50) of the outlet (13). The substrate (10) is mounted on a preheating chamber (126) comprising infrared heater (120) and surrogate substrate (11). The heater (120) is energised from power source (134) controlled by controller (132) responsive to the output of thermocouple (130) attached to substrate (11). In use the reflector is moved towards the substrate (10) until the outlet (13) contacts a chip on the substrate (10). The reflector is then backed off a predetermined distance which is such that the focal plane of the heat energy focused by the reflector (44), coincides with the solder containing space between the chip and the substrate.