| 摘要 |
<p>PURPOSE:To obtain a device which suits to mass-production by stabilizing its quality and by reducing its cost, by burning solder paste applied onto an external lead constituting a lead frame. CONSTITUTION:Lead frame 1 of copal or the like is washed by using a trichloroethylene solvent or alkali solvent first and then washed again by using an acid solvent of HCl. On external lead 4 of frame 1, solder paste 6 of 38% of fine grains Pb-Sn and approximate 70% of resin, antimony chloride, soft petroleum, wax, etc., is screen-printed and burned at approximate 170 deg.C to be adhered completely. Then, semiconductor device 3 sealed by epoxy resin is fixed onto frame 1 and after the device is separated into pieces, lead 4 is lent to obtain products.</p> |
