| 摘要 |
PURPOSE:To realize mounting structure of semiconductor module excellent in workability of maintenance and replacement by providing a specified probe and frame type connector, accommodating a ceramic substrate in a frame of a housing of the connector mounted on a printed wiring board, and attaching a semiconductor module to the frame type connector by a freely detachable means. CONSTITUTION:A spring contact probe 30 is composed of a probe 32 and an outer cylinder member 31. The head part of the probe 32 comes into pressure contact with the pad part of an input-output pattern 5 led out on the peripheral part of a ceramic substrate 2. The outer cylinder member 31 holds the probe 32 in a cylinder so as to be able to slide. The lower end is inserted into a through hole 11 of a printed wiring board 10 and soldered. A frame type connector 20 is constituted by arranging the spring contact probes 30 in a frame type housing 21. The lower end, of the outer cylinder member 31, protruding from the lower end surface of the housing is inserted into the corresponding through hole 11, and soldered, thereby mounting the connector 20 on the wiring board 10. The substrate 2 is accommodated in the frame of the housing 21; an input-output pad is made to abut against the head part of the probe 32; a module 1 is attached to the connector 20 by using a screw or the like. Hence, the module 1 can be easily detached from the wiring board 10. |
