| 摘要 |
<p>PURPOSE:To highly accurately position a mask and a wafer along the inital warp by finely adjusting a pressure gas system and a vacuum suction system for contacting the mask and the wafer. CONSTITUTION:The vacuum suction and the gap pressure through scavenging pipes 2 and 6 connected with a vacuum suction system and a pipe 7 connected with a pressure system such as N2, respectively, are so adjusted in accordance with the alignment observation of microscopes 9 and 9 that a mask 1 and a wafer 3 are brought into close contact for exposure. If the vacuum system and the pressure system are finely adjusted through finely adjusting valves 21 and 22 which are mounted in the pipes 6 and 7, the roughness of the wafer 3 is finely adjusted so that the wafer 3 is brought into close contact with the mask 1 under the condition having the initial wafer. As a result, even if the wafer has a warp, it is possible to highly accurately position the wafer and the mask.</p> |
