首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BONDING OF FLIPPCHIP INTEGRATED CIRCUIT
摘要
申请公布号
JPS5483375(A)
申请公布日期
1979.07.03
申请号
JP19770150561
申请日期
1977.12.16
申请人
HITACHI LTD
发明人
OOSHIMA MUNEO;NAKAMURA MASANORI
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
KNITTED OR WOVEN FABRIC MADE FROM SHAPE MEMORY ALLOY
PREVENTIVE WORK AGAINST DEWING
PLANTATION CONSTRUCTION
HARD HIGH PURITY PLATINUM ALLOY
MOLYBDENUM SINTERED COMPACT MATERIAL AND MOLYBDENUM MATERIAL
TRAY SUPPLYING DEVICE AND CLASSIFYING DEVICE USING IT FOR ELECTRONIC PART
TETHER TYPE COMMUNICATION SYSTEM UNIT
HEAT INSULATING STRUCTURE OF MOLDED PANEL FOR REFRIGERATED SHIP AND HEAT INSULATING METHOD
CAR WASHING MACHINE
BASE PAPER FOR LAMINATED SHEET
METHOD FOR CORRECTING SHEAR IN IMAGE FOR PRINTER
PRINTING HEAD OF INK JET RECORDING APPARATUS
Process for the preparation of an oxazolidinecarboxylic acid which is useful for preparing therapeutically active taxoids
Preparation of imidazoles
High resolution acoustic pulse-echo ranging system
Virus and subtances related thereto
DOUBLE MASS DAMPER PULLEY
DRIVING FORCE TRANSMISSION DEVICE
HYDRAULIC POWER TRANSMISSION COUPLING
ROLLING BEARING