发明名称 CATALYZING POLYMER FOR METAL DEPOSITION WITH FILM OF PALLADIUM OR PLATINUM COMPLEX
摘要 <p>A metal (nickel, cobalt, copper or gold) layer if formed on the surface of a body of a polymer by degreasing the surface, forming on the degreased surface a film of a thermally decomposable palladium or platinum complex having the formula LmPdXn or LmPtXn, in which L is a ligand or unsaturated organic group; X is a halogen, an alkyl group or a bidentate ligand, m is an integer from 1 to 4 and n is zero or an integer from 1 to 3, heating the film on the surface to decompose the complex and leave, on the surface, a residue catalytic to an electroless metal-plating bath and then treating the catalysed surface with such a bath. When the polymer is polyethylene terephthalate or polypropylene, the complex is preferably bis-benzonitrile palladium dichloride; 1,3-butadiene palladium dichloride or bis-acetonitrile palladium dichloride and the film is heated at a temperature between 50 and 150.degree.C. When the polymer is polyethylene, the complex is preferably bis-benzonitrile palladium dichloride; 1,3butadiene palladium dichloride or bis-acetonitrile palladium dichloride and the film is heated at a temperature up to 98.degree.C When the polymer is a polyimide, the complex is preferably bis-trimethyl-phosphite palladium dichloride and the film is heated at a temperature up to 210.degree.C. The film of the complex is preferably formed by applying the complex in solution in a solvent which readily flashes off.</p>
申请公布号 CA1057596(A) 申请公布日期 1979.07.03
申请号 CA19750230045 申请日期 1975.06.24
申请人 AMP INCORPORATED 发明人 BRUMMETT, CHARLES R.;SHAAK, RAY N.;ANDREWS, DANIEL M.
分类号 H05K3/18;C23C18/30;(IPC1-7):23C3/04 主分类号 H05K3/18
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