| 摘要 |
PURPOSE:To achieve the reduction in size and thickness of the watch and the reduction in cost by providing serrations to the external parts of the thermosetting ressin which seals semiconductor element portions placed, secured and connected on an insulation substrate formed with circuit patterns thereby providing an escape and support plate for mechanical parts. CONSTITUTION:A semiconductor element 3 is placed and secured onto an insulation substrate 1 formed with circuit patterns 2 and connection is performed between the electrodes of the semiconductor element 3 and circuit patterns 2 by fine metal wires 4, after which sealing by a thermosetting resin 7 by the use of transfer molding dies is performed. At this time, a recess 11 as an escape for the screw pin 15 of mechanical parts and the supporting face 12 of a correcting lever 13 are formed with good accuracy in the mold shape of the thermosetting resin 7 by the transfer molding dies. Thereby, the fitting of the circuit block and mechanical parts of the electronic watch is accomplished without any waste and the need for separate parts such as spacers, etc. of the device is eliminated. |
