发明名称 |
STRUTTURA DI RAFFREDDAMENTO DI DISPOSITIVI SEMICONDUTTORI. |
摘要 |
A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. |
申请公布号 |
IT7923939(D0) |
申请公布日期 |
1979.06.28 |
申请号 |
IT19790023939 |
申请日期 |
1979.06.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
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分类号 |
H05K7/20;H01L23/42;H01L23/427;H01L23/44;H01L23/473;(IPC1-7):H01L/ |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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