| 摘要 |
PURPOSE:To make it possible to simplify manufacture processes, and to realize mass-production, by providing a sound absorption part made of a photosensitive material to the edge part of a chip provided with an input-output transducer. CONSTITUTION:On piezoelectric substrate 10, Al layer 11 is vapordeposited, on which the pattern of input-output transducer TD12 is formed by photochemical technique. Next, resist 13 is applied onto the entire surface of the chip and chip edge part 14 close to TD12 is exposed in common with the adjacent chips. Next, after the substrate is divided into chips, unexposed part 13 of the center resist except edge part 14 at both sides of each chip 10 is dissolved and removed by using a developer, thereby constituting an elastic surface wave element provided with sound absroption parts of a resist at its both edge parts 14. |
