发明名称 NAIL HEAD BONDING METHOD
摘要 PURPOSE:To perform wiring of high reliability by nail head bonding a noble metal wire to a metal body then again thermocompression bonding the noble metal lump. CONSTITUTION:A gold wire 5 is bonded 52 onto a lead frame 12 which comprises cladding an Al thin plate 14 on a Fe or Fe-Ni alloy plate 13. A ball 51 is again formed to the gold wire 5 having been led out from the end of a capillary 4 in order to reinforce the purple plague part thereof and is compression bonded to the bonding part 52, after which the gold wire 5 is cut and again the gold ball 51 is made, thence the next bonding cycle is started. Then, bonding may be surely performed even if the frame of the Al clad material is used and the use of fine gold wire is feasible.
申请公布号 JPS5477571(A) 申请公布日期 1979.06.21
申请号 JP19770144874 申请日期 1977.12.02
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 TAYA TOYOHIRO
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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