| 摘要 |
<p>PURPOSE:To facilitate pellet exfoliation after separation by separating a wafer into plural elements in the state where the wafer and a sheet are caused to adhere to each other by adhesive which has a stronger adhesion force for the sheet surface than that for the main face of the semiconductor wafer. CONSTITUTION:On the reverse face of wafer 1 where elements 3 which have been already subjected to diffusion and evaporation are arranged in checkers, adhesive 2 which is made of a thin film by drying and has a weaker adhesion force for the face of wafer 1 than that for sheet 12 sticked onto wafer 1 is applied. Next, sheet 12 which has an expansion restoration property and an adhesion property is sticked throughout the surface of adhesive 2, and wafer 1 is separated into individual elements 3 after notch lines are provided between elements of wafer 1. After that, inside ring 13a of ring materials which have a diameter larger than wafer 1 is covered with sheet 12, and sheet 12 is mounted on cylindrical holder 14 after being held between inside ring 13a and outside ring 13b. Next, ushing-up bar 15 is pressed up from the lower face of holder 14, and collet 16 is used to adsorb individual pellets 3.</p> |
