| 摘要 |
PURPOSE:To lead out mechanically and chemically stable terminals by bonding an insulation plate to a diaphragm in such a manner that its conductor parts approach to the conductor circuit terminals of the diaphragm, and bonding the conductor part of a insulation plate with this. CONSTITUTION:After a diaphragm 21 and a net 26 are bonded to the front and back surfaces of a frame 25, an insulation plate 27 is bonded onto the diaphragm 21 in such a manner that its recesses 30, 31 are positioned at the terminals 23, 24 of a conductor circuit 22. Ultrasonic soldering is then applied to the terminals 23, 24. In this case the tip of the iron of an ultrasonic soldering device is applied diagonally to the recesses 30, 31 of the insulation plate 27, by which the area for rubbing the iron tip to the terminals 23, 24 may be sufficiently taken. If soldering parts 32, 33 are good without having block solder, etc., these parts and the cnductor parts 28, 29 of the insulation plate 27 are soldered and further lead wires 36, 37 are soldered to these parts. Soldering of this case can be either ultrasonic method or ordinary method. Thereby, the mechanically and chemically stable terminals may be led out. |
