| 摘要 |
PURPOSE:To improve resistance to soldering heat, mechanical strengths and surface smoothness, by stretching and thermally setting a resin compsn. comprising a specific polyarylene sulfide and a highly heat-stable polyarylene thioetherketone. CONSTITUTION:100pts.wt. linear polyarylene sulfide of a melt viscosity of at least 1,000 P is compounded with from 5 to less than 100pts.wt. highly heat- stable polyarylene thioetherketone having repeating units of the formula (wherein -CO- and -S- groups are para with respect to each other in a benzene ring) as the main structural unit, an m.p. of 310-380 deg.C, a melt crystallization temp. (420 deg.C/10min) of at least 210 deg.C, a residual enthalpy of melt crystallization of at least 10J/g and a reduced viscosity (in 98% sulfuric acid, 0.5g/dl, 25 deg.C) of 0.3-2dl/g, extruded into a sheet form at 340-420 deg.C and quenched at a rate of at least 200 deg.C/min to give an amorphous sheet, which is stretched at 80-170 deg.C in one direction or in both the longitudinal and transverse directions with the stretching ratio at least in one direction being 1.5-7, and then thermally set at 270-350 deg.C. |
