| 摘要 |
PURPOSE:To precisely cancel the warp of a heat dissipating plate caused by fusion bonding of solder material by the warp for calibration use, and finish the heat dissipating plate in a accurate flat plate type by previously imparting the warp for calibration use to the heat dissipating plate by an amount obtained by simulation. CONSTITUTION:A specified amount of warp is previously imparted to a heat dissipating plate 11, in the manner in which one surface to bond an insulating substrate 12 becomes a concave face and the other surface becomes a convex face. On the concave face, the insulating substrate 12 like a ceramic plate is arranged by interposing solder 13 constituting wax material. In a heating and cooling process for fusion bonding of solder 13, warp is generated in the heat dissipating plate 11, on account of the difference of thermal expansion coefficients between the heat dissipating plate 11 and the insulating substrate 12. Warp is previously imparted to the heat dissipating plate 11, in the direction opposite to the generated warp. The amount of said imparted warp has been determined in a range that the warp generated in the solder fusion bonding process is canceled. |
