发明名称 HIGH-EFFICIENCY SPUTTERING METHOD
摘要 PURPOSE:To form a thin film on a substrate by uniformly injecting the ionized particles in sheet plasma onto the surface of a conductive target, thereby sputtering the target, and depositing the sputtered particles on the substrate. CONSTITUTION:A plasma source 31 and an anode 32 are arranged with the sputtering region 35 in between, a magnetic field 37 is formed by 2 air-core coils 36, and a high-density plasma current by an arc discharge is drawn into a vacuum chamber 31. Furthermore, a couple of permanent magnets 38 are opposed to enclose the plasma with the target 40 and the substrate 30, and the pole surface of the permanent magnet is paralleled with the surface of the target 40 or the surface of the substrate 39 to be coated with a film to form the plasma into a sheet shape. The plasma is flattened in the direction parallel to the target 40 and the substrate 39 to form a sheet-shaped plasma 41. Besides, a sputtering voltage is impressed on the target 40 by a sputtering power source so that the target 40 is negatively charged with respect to the sheet plasma 41.
申请公布号 JPH0273967(A) 申请公布日期 1990.03.13
申请号 JP19880224733 申请日期 1988.09.09
申请人 ASAHI GLASS CO LTD 发明人 OYAMA TAKUJI;TAKAGI SATORU;HARANO TAKESHI;SUZUKI KOICHI
分类号 C23C14/34;H01L21/203;H01L21/285;H01L31/04 主分类号 C23C14/34
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