| 摘要 |
PURPOSE:To make it possible to detect the break of a wire in an excellent contact state, by clamping one terminal of a wore which bonds an electrode and lead at the other terminal in the assembling process of a semiconductor device. CONSTITUTION:By wire 3 of fixed size sequentially supplied from spool 6, bonding between the electrode of semiconductor chip 1 and lead frame 2 is done in sequence. In order to detect the break of bonded wire 3 after each bonding, either terminal of a couple of detection terminals of break detection circuit I0 for wire 3 is connected to lead frame 2 and the other terminal is connected to clamp part 8 at the edge of wire 3, thereby detecting the break of wire 3. |
