| 摘要 |
PURPOSE:To eliminate tab short and pin loose, by making a connection between a semiconductor pellet and lead part via a wire in a fixed shape. CONSTITUTION:Semiconductor pellet 4 on lead part 2 of the lead frame is connected to lead part 3 via wire 4, and sloping surface 3a which slopes from the non-bonding edge of the lead frame up to the bonding edge is formed at the bonding edge of lead 3. Then, wire 4 is laid along sloping surface 3a and bonded. |
