| 摘要 |
PURPOSE:To improve the yield of products by reducing the zigzaging of a center hole at the time of punching a lead frame, by forming at a fixed angle a groove at a linking-piece part between adjacent lead piece parts. CONSTITUTION:Lead piece parts 20 for the formation of a semiconductor element are formed in one with frame main body 10 extending from the part between link piece parts 11 and 12 toward the side of link piece part 11 and along the length direction of link piece parts 11 and 12 at a fixed interval. Into link piece parts 11, groove 14 is pressed at the nearly middle position between lead piece parts 20 prependicularly to the length directin from the outside of link piece part 11 to its inside not reaching all of width-directional parts. Consequently, link piece part 11 is elongated slightly and balance is kept between link piece parts 11 and 12, so that the zigzaging of center hole 15 can be suppressed to a little. |
