| 摘要 |
<p>PURPOSE:To improve workability and heat radiation characteristic by connecting metal pieces separately from leads for power source and signal of the device. CONSTITUTION:Connecting pieces 12', 13' for holding and positioning are added to a lead frame 2'. Bump electrodes for connecting these are specially provided. External leads are suitably formed and if the piece 12' is gripped with a pincette and the pin 15 for positioning of a ceramic substrate is inserted into the hole 14 of the piece 13, then the entire external lead ends align to the wiring patterns 9 on the ceramic substrate. When the positions of the pins and holes are selected, packaging miss may be prevented and the respective metal pieces become heat sinks.</p> |
