| 摘要 |
PURPOSE:To realize amall-sized, thin, and light weight design, and to be suitable for use in wristwatches, by opening a through-hole to insert a semiconductor element into a printed wiring substrate, and covering the back with adhesive tape, resin- sealing the substrate and the element by wire bonding, and then removing the adhesive tape. CONSTITUTION:A wiring 23 made of copper or the like is formed on a substrate made of glass, epoxy, paper phenol, or the like, to compose a printed wiring substrate 21, and a through-hole to store a semiconductor element is machined at a specified position. The back of the substrate 21 is coated with a heat resistant adhesive tape, and a semiconductor element 22 is inserted into the through-hole being in contact with the tape and is secured by adhesion. Using a gold wire 25, the wiring 23 is bonded with ultrasonic waves. Then, the gap between the element 22 and the substrate 21 is filled with epoxy resin 24 or the like, coating also the bonding surface and the gold wire 25. And the tape now unnecessary is removed. Thus, shielding from the atmosphere is sufficient, and the weight may be also reduced. |
