| 摘要 |
<p>PURPOSE:To improve thermal coupling of elements and imporve symmetry of circuits by respectively providing additional strip pieces extending to the neighborhood of adjoining die pads to the die pads for bonding respective elements in a lead frame for composite semiconductor device sealing a plurality of semiconductor elements within the same sealing body. CONSTITUTION:The lead frame is constituted by inside leads 7a having die pads 6 at the end, other inside leads 7b, outside leads 8 and a frame 9. Next, semiconductor chips 11 are bonded onto these die pads 6 which oppose to each other symmetrically. These are then connected to the leads 7b by using fine metal wires and are cut off from the frame 9, after which between the leads 7a, 7b, 8 are also cut off. In this constitution, additional strip pieces 10 extending to the neighborhood of other pads are newly provided integrally with the pads 6 to the respective pads 6. Then, the adjoining chips 11 densely thermally couple with themselves, the occurrence of temperature differences is obviated, the symmetry of circuits is improved and characteristics of high accuracy may be obtained.</p> |
