| 摘要 |
The described force transducer has its stress beam mechanism mounted to a transducer reference frame via a dielectric member having a thermal coefficient of expansion virtually identical to that of the beam. The stress beam carrying the thin-film strain gage thereon has a pair of link arms with shims spot welded to it, the outer ends of the shims and arm assembly are cemented (e.g., epoxy) to the dielectric frame member which is molded of, for example, glass bonded mica. A flexure is welded to a coupling which has an insulator rod cemented thereto, the entire assemblage transferring motion from an incoming force to be measured, to the stress beam. The dielectric frame is similarly cemented to the force transducer reference frame providing electrical isolation for the stress beam and included strain gage bridge carried thereon.
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