| 摘要 |
<p>PURPOSE:To avoid the deterioration dependent upon metallic compund generation by providing no dump in the wiring pad of a semiconductor element and forming a bump at the terminal of the finger lead of a tape carrier in the tape carrier system. CONSTITUTION:Tape carrier 11 is formed by resin such as polymide, and metallic foil such as Cu is caused to adhere to one main face of tape rail 2 constituting a carrier by adhesive 3. Next, aperture 15 corresponding to semiconductor element 10 is provided in this metallic foil 14, and finger leads 14f and 14f' consisting of split metallic foil 14 ae caused to stand out in this aperture, and bumps 14b and 14b' such as Au and Zn for leading and connecting to electrode connection pads are provided at the tip lower face of finger leads. After that, the pad provided on element 10 and the bump are positioned to fix the element and the carrier to each other by thermo compression bonding. Thus, the deterioration is prevented even in a high-temperature life, and the cost is lowered.</p> |
