发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PURPOSE:To form an ultra-miniature device by exposing the surface of plural external terminals of the metal plate on the lower surface of the sealing substance and connecting the other end to the element electrode within the sealing substance. CONSTITUTION:Lead frame 14 is sticked onto glass plate 12 via wax 13. In the frame, unit pattern 15 is formed into a matrix shape, and tab 18 and external terminal 19 are provided at the tip of tab lead 17. Pellet 20 is adhered on tab 18, and the electrode is connected (21) to external 11. Then the resin is sticked onto frame 14, and sealing substance 22 covers the pellet, wire and frame. Notch groove 23 is made to reach the glass layer. Then wax 13 is fused, and device 25 unified via sealing substance 22 is isolated from plate 12. In this way, an accurate assembling becomes possible, and thus a large-scale batch process can be carried out.
申请公布号 JPS5469068(A) 申请公布日期 1979.06.02
申请号 JP19770135720 申请日期 1977.11.14
申请人 发明人
分类号 H01L23/28;H01L21/56 主分类号 H01L23/28
代理机构 代理人
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