| 摘要 |
<p>PURPOSE:To reduce the scribing time of semiconductor substrates by turning 90 deg. the other semiconductor substrate which has been scribed in one direction with a fivst scriling machanism, in the horizontal direction by turning mechanism. CONSTITUTION:A semi-conductor substrate is scribed in one direction with a first scribing mechanism 11 and the semiconductor substrate having been scribed is turned horizontally by a turning mechanism 13. The semiconductor substrate having been turned is scribed with a second scribing mechanism 12 in the direction normal to the scribe line having been scribed with the first mechansm 11. At the time of separately scribing the two orthogonal directions with the first, second mechanisms 11, 12 respectively and further scribing two sheets of the semiconductor substrates with the first, second mechanism 11, 12 in order to divide the semiconductor substrates in rectangular shapes by using this apparatus, the other semiconductor substrate which has been scribed already in one direction with the first mechansim 11 is turned 90 deg. in the horizontal direction by the turning mechanism 13.</p> |
