| 摘要 |
<p>PURPOSE:To reduce heat resistance and improve heat radiation characteristic by beforehand providing a metal of good heat conductivity on part or the whole of the back of a lead frame, mounting a semiconductor chip on the front and connecting this to the frame by means of fine metal wires. CONSTITUTION:A metal layer 16 of good heat conductivity is thickly deposited on the back of the island part 11 of a lead fram mounting a semiconductor chip 12 and a metal layer 16 of good heat conductivity is likewise provided on the back of the inner lead part 13 of the frame. With such constitution, the chip 12 is secured onto the island part 11 and the chip 12 and lead parts 13 are connected by means of fine metal wires 14 via bonding metals 15. Then, the heat evolved in the chip 12 may be diffused sufficiently and the contact between the fine wires 14 and lead parts 13 is improved with a resultant decrease in heat resistance.</p> |
