| 摘要 |
PURPOSE:To obtain sufficient connection strength by connecting a conductive pattern formed on the external surface of a glass column to a soldering part for a lead frame fixed to a ceramic substrate by reflow bonding. CONSTITUTION:A solder agent 8 is deposited on the lead frame connected to a lead out pattern 12 previously and the conductive pattern 2 and one end of the lead frame 7 are connected mutually by reflow bonding. Thus, the lead frame 7 and conductive pattern 2 are connected by the reflow bonding, so the connection part of constant sufficient area can be secured and a constant amount of the solder agent 8 can be supplied to the soldering part between the lead frame 7 and conductor pattern 2, so the connecting part securely has necessary strength. Further, a defect such as a bridge, an icicle, and a blow hole which are easy to generate in the reflow bonding is hardly caused and the connection strength is secured stably. |
