发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To avoid the electric performance from being defected due to the pending down of the metal fine wire, by providing the frame, so that it encloses partly or entirely the pellet mounting section and the pellet. CONSTITUTION:After mounting the pellet 12 on the pellet mounting secton 11' of the lead frame, the frame 14 consisting of the electric insulator preventing the pending down of the bonding metal fine wire 13 is placed, and the electrode on the pellet and the external lead 11 of the lead frame are connected with the bonding fine wire 13.
申请公布号 JPS5461471(A) 申请公布日期 1979.05.17
申请号 JP19770128468 申请日期 1977.10.25
申请人 NIPPON ELECTRIC CO 发明人 ADACHI ITSUROU
分类号 H01L23/50;H01L21/60;H01L23/48 主分类号 H01L23/50
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