发明名称 PROCEDE POUR MONTER DES COMPOSANTS SUR DES PLAQUETTES A CIRCUIT IMPRIME, MOYENNANT L'UTILISATION D'UN DISPOSITIF AUXILIAIRE DE MONTAGE
摘要 A circuit board 1 provided with terminal receiving holes 6 is to be provided with components. The component positions are visually indicated to the assembler by a display device. A light spot is traced rapidly in a pattern characterising each component and positioned to indicate the relevant holes 6 in accordance with a predetermined assembly program. image patterns such as 2', 3' or 4' may be achieved. The image is traced sufficiently frequently that the assembler perceives a static image. <IMAGE>
申请公布号 BE873834(A1) 申请公布日期 1979.05.16
申请号 BE19790193181 申请日期 1979.01.31
申请人 SIEMENS S.A. 发明人
分类号 H05K13/00;(IPC1-7):H05K/ 主分类号 H05K13/00
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