| 摘要 |
PURPOSE:To achieve the reduction in thickness by assembling circuit elements on a piezoelectric ceramics plate with electrodes thereby integrating these. CONSTITUTION:A transistor Tr, resistance elements R1, R2 and metal diaphragm 4 being passive and active circuit elements are assembled on a piezoelectric ceramic plate 1 mounted with elecrodes 2' thru 2'''. The transistor Tr is electrically connected to the electrodes 2', 2'' and metal diaphragm 4, the resistance element R1 to the electrodes 2', 2'' and the resistance element R2 to the electrode 2''', metal diaphragm 4 respectively. Lead wires 9, 9' for input are led out from the electrodes 2', 2'''. Thereby, the need for the lead wires connecting the circuit elements Tr, R1, R2 and the electrodes 2 thru 2''' is eliminated, the device is made thinner in size and its handling is made easier. |
