| 摘要 |
<p>In devices including a body of semiconductor material having layers of solder on a surface thereof serving as current connectors, flow of solder from the layers to terminal leads soldered to the layers during the terminal lead soldering process is prevented by the presence of a gap between the terminal leads and the solder layers. Electrical connection between the solder layers and the terminal leads is provided by conductive regions within the body to which the terminal leads and the solder layers are contacted.</p> |
