发明名称 VAPOR DEPOSITION APPARATUS
摘要 PURPOSE:To provide a vapor deposition apparatus which is capable of forming uniform deposited membrane, by smooth transmission of revolution between a wafer chucking jig and chuck setting jig by use of a gear mechanism. CONSTITUTION:A main shaft 3 is made to pass through a supporting rod 2 installed at the upper part of a treating space in a bell jar, and at the lower end of the main shaft 3 is attached a supporting plate 7 which extends horizontally in three directions. At the three extended ends of the plate 7 are fitted rotatable shafts 8. A spring belt is applied to a pulley 10 fixed at the upper end of the shaft 8 and to outer periphery of a supporting pipe 6, so that the pulley 10 is rotated by the rotation of the main shaft 3. The lower part of the shaft 8 pierces the center of a master pulley 13, and at the projected end of the pulley 13 is fixed a chuck setting jig 15. At the peripheral part of the jig 15 are attached six rotatable shafts 16, to which are fixed disc wafer-chucking jigs 20 at the lower ends. The transmission of revolution between the jigs 15 and 20 is conducted with a master gear 26 and an auxiliary gear 27 which are coupled directly. In Figure, 24, 22 show material to be evaporated and wafers respectively.
申请公布号 JPS5458690(A) 申请公布日期 1979.05.11
申请号 JP19770124534 申请日期 1977.10.19
申请人 HITACHI LTD;HITACHI ELECTR ENG 发明人 IKEDA KENICHI;ASAMI YASUSHI;HASHIMOTO TOSHIO;NAGASAKI TAKAO;MURAKAWA YUKIO;NAGASAKI KEIICHI
分类号 C23C14/50 主分类号 C23C14/50
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