| 摘要 |
PURPOSE:Without using the adhesive wax to the semi conductor wafer, super polishing is effected by holding the supporting plate with the form of convex feature in the neighborhood of the wafer holding surface. By doing so, polishing characteristics can be improved. CONSTITUTION:A polishing table 1 is rotated by a driving shaft 2 and in the polishing surface the polishing cloth 3 is sticked. In the counter side of the polishing table 1, a wafer supporting plate 5 attached in a driving shaft 4 for the wafer supporting plate having the eccentric position, is installed. In the supporting surface of the plate 5, a retainer 6 for the wafer supporting is provided and the projected retainer changes its vertical movement automatically by a spring 7. A neighboring portion 5a of the wafer supporting surface is formed in the convex feature and a wafer to be polished 9 is supported through a pad 8 for obtaining the polishing surface with improved and flatness accuracy. |
