发明名称 |
Silver-electroplating method using thiocyanic solution |
摘要 |
An electroplating method using an aqueous solution containing thiocyanic ions in an amount of 0.5 to 10 moles/l, silver ions in an amount of 0.04 to 0.8 mole/l and a film improving agent in an amount effective to suppress a local growth of a silver film on a metallic substrate to be plated, which comprises subjecting, prior to the electroplating, the metallic substrate to a preplating step under a current density of 0.1 to 80 mA/dm2 in an aqueous solution containing silver ions in an amount of 0.001 to 0.02 mole/l and thiocyanic ions in an amount of 0.1 to 5 moles/l whereby the adhesiveness of the resulting electroplated silver film to the substrate is improved.
|
申请公布号 |
US4153519(A) |
申请公布日期 |
1979.05.08 |
申请号 |
US19780911077 |
申请日期 |
1978.05.31 |
申请人 |
HITACHI, LTD. |
发明人 |
SUZUKI, YOSHIHIRO;MINAKAWA, TADASHI;ASAI, OSAMU |
分类号 |
C25D3/46;C25D5/10;(IPC1-7):C25D3/46 |
主分类号 |
C25D3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|