发明名称 Contoured quartz anode plate
摘要 Sputter deposited coating uniformity is improved by contouring the anode plate to provide thinner regions around the wafer edges so that more resputtered coating material is deposited at the wafer edge to compensate for the observed decrease in coating thickness at the edge.
申请公布号 US4153528(A) 申请公布日期 1979.05.08
申请号 US19780919337 申请日期 1978.06.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DYKEMAN, ROBERT H.;WONG, MAN-CHONG
分类号 C23C14/34;C23C14/40;C23C14/50;H01J37/34;(IPC1-7):C23C15/00 主分类号 C23C14/34
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