发明名称 |
Contoured quartz anode plate |
摘要 |
Sputter deposited coating uniformity is improved by contouring the anode plate to provide thinner regions around the wafer edges so that more resputtered coating material is deposited at the wafer edge to compensate for the observed decrease in coating thickness at the edge.
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申请公布号 |
US4153528(A) |
申请公布日期 |
1979.05.08 |
申请号 |
US19780919337 |
申请日期 |
1978.06.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DYKEMAN, ROBERT H.;WONG, MAN-CHONG |
分类号 |
C23C14/34;C23C14/40;C23C14/50;H01J37/34;(IPC1-7):C23C15/00 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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