| 摘要 |
<p>PURPOSE:To form a mechanism of not damaging the wafer at the time of removing the wafer after working in a dicing device provided with automatic handling mechanism. CONSTITUTION:A wafer 10 is sucked to a Verneuil chuck 14 at the state of feeding. When an arm 15 moves and the wafer comes over a base 11, air jetting 20 is stopped and holding is released. The wafer is sucked to the base 11 and is subjected to grooving. After working, a mechanism 13 moves to push the edge of the wafer on the base 11 and transfer the same onto a jig 12. Even if washing solution intervenes between the bottom of the wafer and the face of the base, the wafer can move with extremely small force because the solution is of low viscosity, thus cracking of the wafer does not occur. The moisture between the bottom face of the wafer and the top face of the jig 12 is slight because of a multiplicity of deep grooves 17 on the top of the jig 12. The chuck 14 moves slightly above the wafer and carries the wafer to a desired position by holding the same in the absence of any contact with the bottom of the chuck owing to air jetting 20. Even at this time, the effect of the grooves 17 causes the wafer to be sucked and prevents the same from being cracked.</p> |
