| 摘要 |
PURPOSE:To facilitate packaging of switching elements by disposing the switching elements which form the matrix networks forming current paths, evenly and at the same number on both sides of resistance heating elements which are provided in one row on an insulation substrate. CONSTITUTION:A plurality of heating elements 2 are provided on one row on an insulation substrate 1 and chip form diode elements 3 forming the matrix circuit network of the heating elements 2 are disposed respectively evenly on the insulation substrate on both sides thereof. These diode elements 3 are connected, every other element, to the electrodes of the heating elements 2 so as to form the row matrix circuits and are so wired that the matrix circuit networks on both sides become equal. Hence, the packaging pitch of the diode elements 3 is expanded, whereby packaging of the swtiching elements may be facilitated. In addition, the wiring density of the matrix networks may be made even and the higher density of the heating elements achieved. |
