发明名称 PLASMA FILM FORMING APPARATUS
摘要 PURPOSE:To increase processing capacity in a film forming apparatus by disposing a pair of arc form plasma generating electodes on the outer side of the ring of the wafer group disposed in the ring form on a susceptor and rotating the wafers in a radially erect state. CONSTITUTION:In the plasma film formimg apparatus, a tubular revolving shaft 14 is mounted in a penetrated state in the central part of a bell-jar 11 and is made rotatable by a motor or other. A disc form susceptor 15 is mounted in the upper part of this revolving shaft 14 and a reation gas feed port 16 is provided in the center of the susceptor 15. A doughnut form wafer jig 19 is placed on this susceptor 15 and plural wafers 21 are radially erected on this jig 19. Further a bell-jar cover body 24 is removably mounted in the upper part of the bell-jar 11 and a pair of plasma generating electrodes 25, 26 of semi-arc form plates are mounted to the ceiling 23 of this cover body 24. These electrodes 25, 26 are so disposed as to extend along the outer side of the ring that the wafers 21 radially placed on the jig 19 create.
申请公布号 JPS5456366(A) 申请公布日期 1979.05.07
申请号 JP19770122357 申请日期 1977.10.14
申请人 HITACHI LTD 发明人 YOSHIMI TAKEO
分类号 C23C16/50;C23C16/509;H01L21/205;H01L21/31;H01L21/56 主分类号 C23C16/50
代理机构 代理人
主权项
地址